Die bonders /Microelectronics assembly 
 
Datacon is one of the leading and most innovative providers of assembly equipment for the semiconductor industry and is ahead of the field when it comes to new technologies such as flip chip and RFID (non-contact data transmission). 
 
                               
                     Datacon 2200 EVO                             Datacon CS-1250 die sorter
                           More info                                                   More info
 
           
                          
     
       8800 FC Quantum flip chip bonder                   8800 FC Smart Line RFID chip attach
                  Brochure in pdf format                                          More info
 
sales@scanditron.se