Molding equipment for electronics

Fico molding systems have a modular design which allows encapsulation of 1 up to 16 strips simultaneously. The equipment will significantly increase yields, whilst keeping cost of ownership low. Besides automatic machines for high volume production, manual machines are available that can run production with the same molds.  

The AMS-W is the most economic and flexible MAP molding system, dedicated to the latest trend in single- sided packaging. It is the molding solution for products like QFN, BGA, BOC and BGA-MAP, including high end applications such as flip chip, multi chip array and stacked die.

The MMS-W is a molding system for single-sided products in MAP, such as BGA, QFN etc. The machine has been especially developed for molding process parameter optimization. By making use of the original molds, new products can be developed and optimized prior to large scale production.

                        

                                                              
                   Fico MMS-W                                           Fico AMS-W